Lastest Higher Precision Grinding News

AIT develops short-term bonding wax for precision wafer and substrate back
AIT&#39s back-grinding liquid wax (BGL) can be spun to form 10μm film for precision bonding with a die-shear bond strength of more than 500psi for temperatures 15ºC beneath the melting point. The firm gives the temporary bonding/protective wax in … Release …
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NSG trains commandos to deal with hostage crisis conditions
… time in its three decade-old history, the country&#39s elite counter-terror force NSG has begun education its commandos in undertaking precision hostage rescue missions in jungles keeping in view emerging Naxalite techniques aimed at capturing high-value …
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